Principal Digital Electronics Design Engineer

Description:

In this position you will work closely with multi-disciplinary teams designing, developing, and verifying high reliability digital electronics for use in a wide array of applications. These applications include processor boards, FPGA and SOC boards, memory applications including DDR and high speed I/O. As a principal member of the Harsh Environments Electronics Group you will help shape digital hardware architectures and lead electronics development activities by applying sound engineering and project management principles. Candidate must be self-motivated and capable of working at a high technical level with minimal supervision.

Required Qualifications
 

• Experience working with and knowledge of trade space for radiation hardened parts
• Schematic capture and board layout experience
• Experience integrating and debugging embedded systems
• Ability to perform circuit simulation using tools such as HyperLynx or Ansys
   

Preferred Qualifications
 

• Experience in Mentor Graphics PCB design flow
• Experience with Xilinx or Microchip FPGA/SOC design flow
• Experience in design for harsh environments as embodied in common commercial and military standards (e.g. RTCA/DO-160, MIL-STD-810, etc.)