Description:
Responsibilities include:
- Support Hardware design, analysis ,and simulations for all Microsytems products and engineering responsibilities
- Design, model, simulate, and analysis of high frequency packages and boards for System in Packages(SiP), Space SSDR's with flex circuits, high-speed products, power modules and custom products
- Understand customer applications and industry standards to support defining the product specifications to meet all signal and power integrity requirements
Support all interface types including high-frequency RF, DDR4/DDR5, ?50Gb/s
- Work cross-functionally with electrical, package design, mechanical, test and manufacturing engineers to plan and architect the power delivery and Signal integrity needs of packages and PCBs for Microsystems next generation products
- Work with leading suppliers to define and innovate new ideas to enable the Aerospace, Defense, and Space technology industry while pushing the boundaries to achieve unprecedented performance on our products using the latest EDA tools and methodologies
- Participate in all aspects of engineering review process which includes schematic review, functional specification, PCB/substrate/Interposer placement review and PCB/substrate/Interposer routing reviews
- Stackup creation and guidance to hardware engineers for all PCB/Substrate/Interposer designs
- Support power integrity including AC and DC analysis and provide feedback to layout / hardware engineering
- Conduct cross talk analysis and provide feedback to layout and hardware engineering
- Documenting signal integrity rules for hardware engineers and CAD layout
To succeed in this role, you should have the following skills and experience:
- Minimum Education: Bachelor's Degree in Electrical Engineering
- Minimum Experience: 10+ Years in Electrical Engineering
- Must be able to obtain and maintain a government security clearance
- Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, Interposers, substrates)
- Strong understanding of Electromagnetic fundamentals and transmission line theory, along with signal and power distribution systems
- Understanding of jitter and cross-talk and how it impacts the design in the system environment
- Able to navigate in layout tools used for PCB and Packages Cadence Allegro preferred
- High speed channel simulations for low BER and transient simulation for SI and PI, along with measuring and correlating to lab analysis
- Detailed understanding of s-parameters, Smith Chart and frequency domain analysis
- Simulation of passive and active components with the following tool sets: Ansys HFSS and HFSS 3D Layout, SIwave Electronics Desktop , HSPICE, Q3D, Keysight ADS, and SiSoft QSI / QCD
- Work effectively individually and as part of a team with little oversight
- Good time management, communication (verbal & written), decision-making, and organization skills
- Embrace the company culture that includes the following values and behaviors:
Teamwork, execution, and communication
- Integrity, trust, customer focus, commitment, and a sense of urgency
- Delivering results, innovation, helping and caring for others, recognizing and rewarding success, and life-long learning